In two third party funded research projects, technologies for the miniaturization of electronic assemblies are to be developed. You will also carry out practical work on material dosing and precision assembly with complex automated manufacturing equipment and evaluate the results of your work independently.
You will work within an innovative and structured research team on packaging technology at the Wedding Campus of the Technical University of Berlin. Extensive laboratories with excellent equipment are available for your research work.
a) Very good basic understanding of natural sciences proven by a successfully completed a scientific university degree (Master, Diplom or equivalent) in mechanical engineering / physics / process technologies / materials science or similar
b) Good knowledge of German and good English (oral and written)
c) Knowledge in the following topics, would be desirable:
- Programming of manufacturing equipment
- Experience in material dosing/adhesive joining technology
- Experience in microelectronics packaging technology
- Experimental work, planning & conduction, ideally as DoE
- Structured experimental working style
- Willingness to take responsibility for subtasks
- Good teamwork skills within a dynamic team
How to apply:
Please send your application with the reference number
and the usual documents (one file max. 5 MB) only via email to email@example.com
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or quick access 214041.
To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities.
Technische Universität Berlin - Die Präsidentin -Fakultät IV- Elektrotechnik und Informatik, Forschungsschwerpunkt Technologien der Mikroperipherik, Prof. Dr.-Ing. Martin Schneider-Ramelow , Sekr. TIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin