Blätter-Navigation

Offer 82 out of 100 from 16/06/22, 07:55

logo

Tech­ni­sche Uni­ver­sität Ber­lin - Faculty IV - For­schungs­schwer­punkt Tech­no­lo­gien der Mikrope­ri­phe­rik

Research Assistant - salary grade E13 TV-L Berliner Hochschulen

under the reserve that funds are granted; part-time employment may be possible

Working field:

Within a third-party funded research project a new two-step assembly process will be investigated, where in a first step bonding will achieve high position accuracy and in a second step a joint of high quality will be established. Within the project a test vehicle will be fabricated to develop and validate thermo-compression bonding (TCB) processes in a parallel bonding approach.

The work at TU Berlin focusses on the development of test vehicles and the process development in microelectronic packaging and the characterization of the interconnects.

You like to work well-structured and independent within a team. You will be able to understand quickly enough to familiarize yourself with the field of thin film processing, assembly and interconnection technology. You bring the willingness to perform hands-on cleanroom lab work, to prepare the required documentation tasks and to accept responsibilities for different tasks.

Requirements:

  • You have successfully completed a scientific university degree (diploma, master's degree or equivalent) in electrical engineering / micro systems technology / materials science / physics or similar.
  • Knowledge and experience in at least one of the following areas:
a. Chip assembly and interconnection technology
b. Wafer level system integration
c. Development, fabrication and characterization of advanced materials
d. Reliability
e. Measurement technology and analytics
  • Good command of German and English (written and spoken)

Desirable would be the interest in:
a. new topics
b. planning and execution of experiments
c. evaluation and presentation of the results

How to apply:

Please send your application with the reference number and the usual documents (one file max. 5 MB) only via email to personal@tmp.tu-berlin.de.

By submitting your application via email you consent to having your data electronically processed and saved. Please note that we do not provide a guaranty for the protection of your personal data when submitted as unprotected file. Please find our data protection notice acc. DSGVO (General Data Protection Regulation) at the TU staff department homepage: https://www.abt2-t.tu-berlin.de/menue/themen_a_z/datenschutzerklaerung/ or quick access 214041.

To ensure equal opportunities between women and men, applications by women with the required qualifications are explicitly desired. Qualified individuals with disabilities will be favored. The TU Berlin values the diversity of its members and is committed to the goals of equal opportunities.

Technische Universität Berlin - Die Präsidentin -Fakultät IV- Elektrotechnik und Informatik, Forschungsschwerpunkt Technologien der Mikroperipherik, Prof. Dr.-Ing. Martin Schneider-Ramelow , Sekr. TIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin